Overview
This version of the PCB based reflow plate aims to be as modular as possible to allow for many configurations and parts to be replaced. There are 5 main boards in the project:
MCU board
Power board
I/O board
Heating board
Backplane
Pinout
Each of these boards interconnect in order to create a fully functional reflow plate. The boards are stackable allowing for multiple boards to be added. The standard interface between the boards is shown below.
+----------------------+----------------------+
5V ----+ | +---- SDA
| LOGIC POWER | I2C |
3V3 ----+ | +---- SCL
+----------------------+----------------------+
SENSE A ----+ | +---- TX0
| | UART0 |
SENSE B ----+ | +---- RX0
| +----------------------+
SENSE C ----+ TEMPERATURE SENSORS | +---- TX1
| | UART1 |
SENSE D ----+ | +---- RX1
| +----------------------+
SENSE E ----+ | +---- GPIO0
+----------------------+ |
SENSE A ----+ | +---- GPIO1
| | |
SENSE B ----+ CURRENT SENSING | +---- GPIO2
| | GPIO |
SENSE C ----+ | +---- GPIO3
+----------------------+ |
RESET ----+ SYSTEM RESET | +---- GPIO4
+----------------------+ |
NC ----+ | +---- GPIO5
| +----------------------+
NC ----+ | +---- SCLK
| | |
NC ----+ | +---- MOSI
+----------------------+ |
HEATER CONNECTION ----+ | +---- MISO
| HEATER CONNECTIONS | |
HEATER CONNECTION ----+ | +---- SS1
+----------------------+ SPI |
12V ----+ | +---- SS2
| | |
12V ----+ | +---- SS3
| | |
12V ----+ | +---- SS4
| PCB HEATER POWER | |
GND ----+ | +---- SS5
| +----------------------+
GND ----+ | +---- GND
| | LOGIC GND |
GND ----+ | +---- GND
+----------------------+----------------------+
Mechanical Specifications
In order to maintain mechanical compatibility between all boards, a specification has been created to stipulate the positioning of the inter-board connections. The headers have been set at the spacing of a standard 2.54mm breadboard allowing for easy development of custom boards without the cost of PCB manufacture.
The mechanical drawing of the stackable board.